Capcon

BE Semiconductor Industries

This company manufactures assembly and packaging equipment for semiconductor manufacturers, foundries, and electronics companies to produce integrated circuits and electronic devices.

Fonontech

FononTech manufactures microelectronics printing equipment for semiconductor assembly companies to enable 3D chip packaging and electrical bonding of micro-LEDs.

HallTech

This company manufactures thin-film deposition platforms and ion-beam sputtering technology for semiconductor and battery manufacturers.

ePAK

This company manufactures automated transport and handling packaging for the semiconductor industry, supplying wafer fabs, original equipment manufacturers and integrated circuit assembly operations.

IoTech

This company provides additive manufacturing systems using laser technology for electronics manufacturers to produce semiconductor packaging and printed circuit boards.

Lidrotec

Lidrotec manufactures liquid-assisted laser dicing equipment for precision microchip and wafer cutting for semiconductor manufacturers and the medical, energy and electronics sectors.

Demcon photonics

Demcon photonics develops production equipment for integrated photonic assembly and packaging for semiconductor, medical and industrial manufacturing customers.

ESOL

This company manufactures extreme ultraviolet (EUV) light sources and metrology equipment for semiconductor chip makers and photomask producers.