Corintis

Chip heat management

This company develops wafer-level thermal management technology for semiconductor manufacturers operating in the radio frequency, power, and photonics sectors.

NovoLINC

This company manufactures nanostructured thermal interface materials to manage heat dissipation for semiconductor manufacturers and data centre operators.

Ferveret

This company develops waterless liquid cooling systems for high-density data centres and artificial intelligence infrastructure providers.

EU Next-gen chip technology

The company develops graphene-based photonic chips for high-performance computing, artificial intelligence and autonomous vehicle sectors to improve data transmission speed and energy efficiency.

Orbital Materials

Orbital Materials designs AI-generated hardware and cooling fluids for data centre operators to improve thermal efficiency and decarbonise infrastructure.

NcodiN

NcodiN develops photonic interposers and integrated nanolasers to provide high-bandwidth, energy-efficient optical interconnects for chipmakers and data centre operators.

Physical Superintelligence

This company develops a physics simulation platform for large enterprises to optimise data centre cooling systems and energy usage.

CoolSem Technologies

CoolSem Technologies develops wafer-level thermal management stacks for semiconductor and photonic device manufacturers to improve heat dissipation and mechanical reliability.